The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Oct. 20, 2005
Applicant:
Tan Xiaochun, Shanghai, CN;
Inventor:
Tan Xiaochun, Shanghai, CN;
Assignee:
Diodes, Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device that includes multiple heat sinks is provided along with methods for forming a semiconductor device having multiple heat sinks. The semiconductor device includes a first heat sink that is configured as a conductive lead frame. The conductive lead frame is electrically coupled to a conducting area of a semiconductor die. The semiconductor device also includes a second heat sink that is configured as a conductive clip. The conductive clip is electrically coupled to another conducting area of the die. Alternative embodiments of the device may include more than two heat sinks.