The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2010

Filed:

Mar. 10, 2004
Applicants:

Mizuhisa Nihei, Kawasaki, JP;

Masahiro Horibe, Kawasaki, JP;

Yuji Awano, Kawasaki, JP;

Kazukiyo Joshin, Kawasaki, JP;

Inventors:

Mizuhisa Nihei, Kawasaki, JP;

Masahiro Horibe, Kawasaki, JP;

Yuji Awano, Kawasaki, JP;

Kazukiyo Joshin, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0312 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a semiconductor device including a SiC substrate and a heat conductor formed in a hole in the SiC substrate and made of a linear structure of carbon elements.


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