The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2010

Filed:

Oct. 05, 2007
Applicants:

Hiroaki Tsunoda, Kanagawa, JP;

Masahisa Sonoda, Mie, JP;

Inventors:

Hiroaki Tsunoda, Kanagawa, JP;

Masahisa Sonoda, Mie, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to methods of fabricating semiconductor devices, including forming a trench in a semiconductor substrate by a reactive ion etching (RIE) method with a reactive product of film stack of a carbon film/silicon oxide film/carbon-containing silicon oxide film, the trench having an inner surface; and removing the reactive product, by treating the trench with diluted hydrofluoric acid to remove the carbon film and the silicon oxide film followed by treating the film by a hydrofluoric acid vapor phase cleaning (HFVPC) method to remove the carbon-containing silicon oxide film.


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