The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Nov. 13, 2007
Ole Bosholm, Dresden, DE;
Marco Lepper, Dresden, DE;
Goetz Springer, Dresden, DE;
Detlef Weber, Ottendorf-Okrilla, DE;
Grit Bonsdorf, Dresden, DE;
Frank Pietzschmann, Dresden, DE;
Ole Bosholm, Dresden, DE;
Marco Lepper, Dresden, DE;
Goetz Springer, Dresden, DE;
Detlef Weber, Ottendorf-Okrilla, DE;
Grit Bonsdorf, Dresden, DE;
Frank Pietzschmann, Dresden, DE;
Qimonda AG, Munich, DE;
Abstract
The present invention provides a manufacturing method for forming an integrated circuit device and to a corresponding integrated circuit device. The manufacturing method for forming an integrated circuit device comprises the steps of: forming a first level on a substrate; forming a second level above the first level; forming a cap layer on the second level which covers a first region of the level and leaves a second region uncovered; and simultaneously etching a first contact hole in the first region and a second contact hole in the second region such that the etching is selective to the cap layer in the second region and proceeds to a greater depth in the first region.