The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Feb. 25, 2004
Manabu Tsumura, Settsu, JP;
Masahito Ide, Settsu, JP;
Katsuya Ouchi, Nishinomiya, JP;
Masafumi Kuramoto, Anan, JP;
Tomohide Miki, Anan, JP;
Manabu Tsumura, Settsu, JP;
Masahito Ide, Settsu, JP;
Katsuya Ouchi, Nishinomiya, JP;
Masafumi Kuramoto, Anan, JP;
Tomohide Miki, Anan, JP;
Kaneka Corporation, Kita-ku, Osaka-shi, JP;
Nichia Corporation, Anan-shi, Tokushima, JP;
Abstract
A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components or which contains a thermosetting resin and an inorganic member as essential components is provided. A curable composition and light-shielding paste comprising the composition are provided which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member. The curable composition can further contain (G) silica. Also provided is a method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls. The curable composition is excellent in light-shielding ability.