The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2010

Filed:

Jun. 26, 2007
Applicants:

Taku Masai, Tokyo, JP;

Hitoshi Sakuma, Tokyo, JP;

Kyung-ku Choi, Tokyo, JP;

Toshiyasu Fujiwara, Tokyo, JP;

Inventors:

Taku Masai, Tokyo, JP;

Hitoshi Sakuma, Tokyo, JP;

Kyung-Ku Choi, Tokyo, JP;

Toshiyasu Fujiwara, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a thin film device in which resin film does not easily separate. In a thin film device, a conductor pattern is formed on one of the main surfaces of a plate-shaped base, and the conductor pattern is covered with a resin film. This conductor pattern has a bottom face disposed on the main surface of the base, a top face that faces the bottom face and is distant from the main surface of the base, and two side faces that connect the bottom face and the top face. A depressed portion is formed in these side faces, and an insulation film extends into the depressed portion.


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