The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2010

Filed:

Jun. 22, 2004
Applicants:

Kai Schumacher, Hofheim, DE;

Juergen Flesch, Rayong, TH;

Volker Hamm, Bad Saeckingen, DE;

Inventors:

Kai Schumacher, Hofheim, DE;

Juergen Flesch, Rayong, TH;

Volker Hamm, Bad Saeckingen, DE;

Assignee:

EVONIK DEGUSSA GmbH, Essen, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C01B 13/14 (2006.01); C01B 7/00 (2006.01); C01B 33/12 (2006.01); B01D 53/50 (2006.01); B01D 53/68 (2006.01); B01D 53/70 (2006.01); B01D 47/06 (2006.01); B01D 11/00 (2006.01); C01G 23/047 (2006.01); C01F 7/02 (2006.01); B01F 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Process for removing halide compounds adhering to finely divided metal oxide particles by means of steam, wherein the metal oxide particles are applied to the upper part of an upright column and migrate downwards by means of gravity, the steam is applied at the bottom end of the column, the metal oxide particles and the steam are fed counter-currently, the metal oxide particles freed of halide residues are removed at the base of the column, steam and halide residues are removed at the head of the column, wherein the column is heated in such a manner that the temperature difference T−Tbetween the lower part and the upper part of the column is at least 20° C. and a maximum temperature of 500° C. prevails in the column, and the metal oxide particles have a residence time in the column of from 1 second to 30 minutes.


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