The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Jul. 27, 2006
Noriya Hayashi, Nagoya, JP;
Hiroshi Mizuno, Nagoya, JP;
Koichi Hasegawa, Nagoya, JP;
Kazuo Ota, Nagoya, JP;
Noriya Hayashi, Nagoya, JP;
Hiroshi Mizuno, Nagoya, JP;
Koichi Hasegawa, Nagoya, JP;
Kazuo Ota, Nagoya, JP;
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Abstract
Provided is an RTM molding method enabling to yield an FRP molded body formed so as to be increased in the fiber volume content and to thereby be made more excellent in strength and lightweightness. The resin composition is a chain-curing resin composition, and after the initiation of the curing of the resin composition, the highest temperature at the curing head of the resin composition, undergoing chain curing, within 10 seconds after the initiation of the curing is increased to be higher by 50° C. or more than the temperature of the resin composition at after the impregnation and before the curing, and thus, the resin composition is chain-cured with a Vf of 41% or more.