The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
May. 28, 2006
Ramesh S/o Govinda Raju, Singapore, SG;
Ming-li Tan, Singapore, SG;
Yusua Agabus, Singapore, SG;
Patricia A. Beck, Palo Alto, CA (US);
Ramesh S/O Govinda Raju, Singapore, SG;
Ming-Li Tan, Singapore, SG;
Yusua Agabus, Singapore, SG;
Patricia A. Beck, Palo Alto, CA (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
Low cost methods for fabricating microneedles are disclosed. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern on a portion of the seed layer; plating a first metal on the seed layer and over the edge of the nonconductive pattern to create a micromold with an opening that exposes a portion of the nonconductive pattern; plating a second metal onto the micromold to form a microneedle in the opening; separating the micromold with the microneedle formed therein from the seed layer and the nonconductive pattern; and selectively etching the micromold so as to release the microneedle. In another embodiment, the micromold is not required. The method according to this embodiment includes: forming a recess with an apex in a substrate; forming a seed layer on the substrate; forming a nonconductive pattern on a portion of the seed layer that is on a sidewall surface of the recess; plating an electrically conductive material over the seed layer and over the edge of the nonconductive pattern to form a plated layer with an opening that exposes a portion of the nonconductive pattern; and separating the plated layer from the seed layer and the nonconductive pattern to release a hollow microneedle with an offset opening.