The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Oct. 12, 2005
Mikiya Umeyama, Tokyo, JP;
Yutaka Koizumi, Yokohama, JP;
Yukuo Yamaguchi, Tokyo, JP;
Akira Goto, Yokohama, JP;
Masaru Iketani, Atsugi, JP;
Yuichiro Akama, Kawasaki, JP;
Mikiya Umeyama, Tokyo, JP;
Yutaka Koizumi, Yokohama, JP;
Yukuo Yamaguchi, Tokyo, JP;
Akira Goto, Yokohama, JP;
Masaru Iketani, Atsugi, JP;
Yuichiro Akama, Kawasaki, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
In a flexible wiring board for use in, for example, a liquid discharge head, wires disposed on a substrate in parallel are covered with a film material. The flexible wiring board is bendable towards one of a front surface side and a back surface side of the substrate and includes a bending line. The bending line is formed by bending the flexible wiring board along a bending direction crossing a longitudinal direction of the wires. The bending line contains the wires. Both ends of the flexible wiring board in the bending direction are located on the bending line. A distance between one of the wires located closest to one end of the flexible wiring board and the one end is larger on the bending line than in another part of the flexible wiring board. Accordingly, even if the flexible wiring board is bent at a small bend radius, peeling does not easily occur between a base film and a cover film.