The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7784165 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 31, 2010

Filed:

Apr. 19, 2006
Applicants:

Hong Xiao, Farmington Hills, MI (US);

Richard Swanson, Frankfort, IL (US);

Inventors:

Hong Xiao, Farmington Hills, MI (US);

Richard Swanson, Frankfort, IL (US);

Assignee:

Material Science Corporation, Elk Grove, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 11/00 (2006.01); B23P 17/00 (2006.01); E04B 1/82 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a panel constrained layer damper treatment from a laminate, having a panel and a visco-elastic layer attached thereto, by forming a panel constrained layer damper from the laminate to a predetermined shape is provided. Additionally, the method of the present invention includes attaching the panel constrained layer damper to a substrate to form the panel constrained layer damper treatment. The method may also include subjecting the panel constrained layer damper to heat energy to bond the visco-elastic layer to the substrate. In addition, various methods of attaching the panel constrained layer damper to the substrate are provided.


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