The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2010

Filed:

Aug. 04, 2006
Applicants:

Yong-xing You, Shenzhen, CN;

Ke-you HU, Shenzhen, CN;

Hai-qing Zhou, Shenzhen, CN;

Feng-long He, Shenzhen, CN;

Inventors:

Yong-Xing You, Shenzhen, CN;

Ke-You Hu, Shenzhen, CN;

Hai-Qing Zhou, Shenzhen, CN;

Feng-Long He, Shenzhen, CN;

Assignees:

Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A card for simulating peripheral component interconnect (PCI) loads includes an interface configured for electrically connecting to a motherboard and a load circuit configured for simulating the different loads. The load circuit comprises at least one power module receiving a voltage from the interface. The power module is capable of changing resistance of the power module thereby to thermally consume various powers to simulate the different loads. Because the card consumes various power according to testing requirement, the stability of the motherboard can be tested in various load power without connecting actual PCI loads to the motherboard.


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