The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Nov. 03, 2008
Takuji Matsushiba, Kanagawa, JP;
Aya Minami, Kanagawa, JP;
Yohichi Miwa, Kabnagawa, JP;
Taichiroh Nomura, Kanagawa, JP;
Kenji Tsuboi, Kanaawa, JP;
Takeshi Wagatsuma, Kanagawa, JP;
Masatake Yamamoto, Kanagawa, JP;
Takuji Matsushiba, Kanagawa, JP;
Aya Minami, Kanagawa, JP;
Yohichi Miwa, Kabnagawa, JP;
Taichiroh Nomura, Kanagawa, JP;
Kenji Tsuboi, Kanaawa, JP;
Takeshi Wagatsuma, Kanagawa, JP;
Masatake Yamamoto, Kanagawa, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper surface of the semiconductor chip; a thermally conductive member thermally connecting the thermally conductive board to the semiconductor chip; and a plurality of fasteners passing through the thickness of the circuit board in an area surrounding the semiconductor chip to attach the heat sink to the thermally conductive board.