The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Jun. 13, 2008
Shinji Takeda, Tsukuba, JP;
Takashi Masuko, Tsukuba, JP;
Masami Yusa, Shimodata, JP;
Tooru Kikuchi, Hitachi, JP;
Yasuo Miyadera, Tsukuba, JP;
Iwao Maekawa, Hitachi, JP;
Mitsuo Yamasaki, Takahagi, JP;
Akira Kageyama, Niiza, JP;
Aizou Kaneda, Yokohama, JP;
Shinji Takeda, Tsukuba, JP;
Takashi Masuko, Tsukuba, JP;
Masami Yusa, Shimodata, JP;
Tooru Kikuchi, Hitachi, JP;
Yasuo Miyadera, Tsukuba, JP;
Iwao Maekawa, Hitachi, JP;
Mitsuo Yamasaki, Takahagi, JP;
Akira Kageyama, Niiza, JP;
Aizou Kaneda, Yokohama, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.