The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Mar. 30, 2004
Hideki Mori, Kanagawa, JP;
Hirokazu Ejiri, Kanagawa, JP;
Kenji Azami, Kanagawa, JP;
Terukazu Ohno, Kanagawa, JP;
Nobuyuki Yoshitake, Kanagawa, JP;
Hideki Mori, Kanagawa, JP;
Hirokazu Ejiri, Kanagawa, JP;
Kenji Azami, Kanagawa, JP;
Terukazu Ohno, Kanagawa, JP;
Nobuyuki Yoshitake, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
By stably separating a melting location of a fuse () from conductive layers (A,B), reliable melting of the fuse () is enabled. A fuse () including a fuse body (A) and two pads (Ba,Bb) connected by this and two conductive layers (A,B) individually connected to the two pads (Ba,Bb) are formed in a multilayer structure on a semiconductor substrate (). A length of the fuse body (A) is defined so that the melting location of the fuse () becomes positioned in the fuse body (A) away from the region overlapped on the conductive layer (A orB) when an electrical stress is applied between two conductive layers (A,B) and the fuse () is melted.