The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2010

Filed:

Sep. 10, 2004
Applicants:

Reid N. Orth, Ithaca, NY (US);

David M. Lin, Ithaca, NY (US);

Theodore G. Clark, Ithaca, NY (US);

Yung-fu Chang, Ithaca, NY (US);

Harold G. Craighead, Ithaca, NY (US);

Jose Manuel Moran-mirabal, Ithaca, NY (US);

Inventors:

Reid N. Orth, Ithaca, NY (US);

David M. Lin, Ithaca, NY (US);

Theodore G. Clark, Ithaca, NY (US);

Yung-Fu Chang, Ithaca, NY (US);

Harold G. Craighead, Ithaca, NY (US);

Jose Manuel Moran-Mirabal, Ithaca, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C40B 50/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An array is formed with a protective cover on a substrate. The protective cover is patterned to produce an array of openings to the substrate. Desired material is deposited on the substrate through the openings. The protective cover may then be removed. In one embodiment, the protective cover is a conformal polymer, such as di-para-xylylene. It may be removed by mechanical peeling. The material may be biological material such as DNA. The protective cover may be used to prevent non-specific hybridization in inter-spot regions by performing hybridization with the cover still in place. Hybridization that occurs in such regions between the spots may be removed with removal of the protective cover.


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