The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Feb. 06, 2007
Takeshi Matsumura, Osaka, JP;
Masaki Mizutani, Osaka, JP;
Sadahito Misumi, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The dicing die-bonding film of this invention comprises a pressure-sensitive adhesive layer () on a supporting base material () and a die-bonding adhesive layer () on the pressure-sensitive adhesive layer (), wherein a releasability in an interface between the pressure-sensitive adhesive layer () and the die-bonding adhesive layer () is different between an interface (A) corresponding to a work-attaching region () in the die-bonding adhesive layer () and an interface (B) corresponding to a part or the whole of the other region (), and the releasability of the interface (A) is higher than the releasability of the interface (B). According to this invention, there can be provided a dicing die-bonding film excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.