The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2010
Filed:
Mar. 26, 2008
Olaf Zschieschang, Viernheim, DE;
Andreas Laschek-enders, Bensheim, DE;
Olaf Zschieschang, Viernheim, DE;
Andreas Laschek-Enders, Bensheim, DE;
IXYS CH GmbH, Lampertheim, DE;
Abstract
An arrangement between a power semiconductor module and a printed circuit board is disclosed, A printed circuit board includes strip conductors, and a power semiconductor module includes a module housing and power terminals. The power terminals extend to the exterior of the module housing and into contact with the strip conductors. A heat sink is disposed on a side of the power semiconductor module opposite the circuit board. A deformable means is disposed between the module housing and the circuit board and is configured to relieve a contact pressure load on the power terminals. A contact-pressure element is disposed on a side of the circuit board opposite the power semiconductor module. The contact-pressure element is integral with a first housing part of an arrangement housing, and the heat sink is integral with a second housing part of the arrangement housing. The two housing parts enclose the circuit board.