The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2010

Filed:

Jul. 01, 2004
Applicants:

Hiroaki Sano, Nakakoma-gun, JP;

Masaru Nagashimada, Nakakoma-gun, JP;

Shinji Ishida, Isehara, JP;

Hideya Fujihara, Nirasaki, JP;

Satoshi Yamanushi, Nirasaki, JP;

Inventors:

Hiroaki Sano, Nakakoma-gun, JP;

Masaru Nagashimada, Nakakoma-gun, JP;

Shinji Ishida, Isehara, JP;

Hideya Fujihara, Nirasaki, JP;

Satoshi Yamanushi, Nirasaki, JP;

Assignee:

Terumo Kabushiki Kaisha, Shibuya-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/02 (2006.01); B29C 65/18 (2006.01); B29C 65/74 (2006.01);
U.S. Cl.
CPC ...
Abstract

A tube connecting apparatus that can carry out self reset operation without giving damage to the apparatus and that safety of an operator is considered. The tube connecting apparatus has an EEPROM memorizing information with respect to a connecting process state of tubes. When electric power is inputted, the apparatus judges whether power supply was shut off during tube connecting operation based upon the information memorized in the EEPROM with respect to the connecting process state of tubes and a detecting result of a waferaccording to a wafer position detecting sensorand carries out reset operation. In the reset operation, the apparatus restarts and completes connecting operation (Sto) by heating the wafer again to fuse the tubes adhered to the wafer (S). Error indication is displayed at a LCD display to secure connecting strength and the like (S). A locking state is not cancelled during cooling time after heating of the wafer is stopped to secure safety (Sto S).


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