The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2010
Filed:
Apr. 03, 2007
Raymond G. Beausoleil, Redmond, WA (US);
Scott Corzine, Sunnyvale, CA (US);
Sean Spillane, Mountain View, CA (US);
Wei Wu, Mountain View, CA (US);
R. Stanley Williams, Portola Valley, CA (US);
Raymond G. Beausoleil, Redmond, WA (US);
Scott Corzine, Sunnyvale, CA (US);
Sean Spillane, Mountain View, CA (US);
Wei Wu, Mountain View, CA (US);
R. Stanley Williams, Portola Valley, CA (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
Various embodiments of the present invention are directed to integrated circuits having photonic interconnect layers and methods for fabricating the integrated circuits. In one embodiment of the present invention, an integrated circuit comprises an electronic device layer and one or more photonic interconnect layers. The electronic device layer includes one or more electronic devices, and the electronic device layer is attached to a surface of an intermediate layer. One of the photonic interconnect layers is attached to an opposing surface of the intermediate layer, and each of the photonic interconnect layers has at least one photonic device in communication with at least one of the electronic devices of the electronic device layer.