The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2010
Filed:
Feb. 08, 2007
Hong-kweun Kim, Ansan-si, KR;
June-hyeon Ahn, Suwon-si, KR;
Ki-hyun Kim, Suwon-si, KR;
Seok-myong Kang, Hwaseong-si, KR;
Youn-ho Choi, Suwon-si, KR;
Hong-Kweun Kim, Ansan-si, KR;
June-Hyeon Ahn, Suwon-si, KR;
Ki-Hyun Kim, Suwon-si, KR;
Seok-Myong Kang, Hwaseong-si, KR;
Youn-Ho Choi, Suwon-si, KR;
Samsung Electronics Co., Ltd., Maetan-Dong, Yeongtong-Gu, Suwon-Si, Gyeonggi-Do, KR;
Abstract
Disclosed is an interposer including a polyhedral body having first and second surfaces facing each other, a plurality of electric terminals formed on the first surface; and a plurality of vias extending through the first and second surfaces. In addition, a semiconductor package includes a printed circuit board having a plurality of electric contacts formed on an upper surface and an interposer having first and second surfaces facing each other, vias extending through the first and second surfaces, and first electric terminals formed on the first surface. The interposer is seated on the printed circuit board so that the vias correspond to the electric contacts.