The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2010
Filed:
Mar. 27, 2008
Applicants:
Masaki Utsumi, Kyoto, JP;
Takashi Takata, Shiga, JP;
Masahiro Iidaka, Kyoto, JP;
Inventors:
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); B65B 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
Viaspenetrating a circuit substrateor a seal ringare provided on a part or the entire outer periphery of a molding semiconductor deviceor in the cut region of the circuit substrate, so that adhesion between a substrate and a coreC in the circuit substrateis improved. Therefore, it is possible to suppress the exfoliation of the circuit substrate, improving the yields.
Quick Actions:
Utsumi, Masaki. (2010). Circuit substrate, molding semiconductor device, tray and inspection socket (U.S. Patent No. 7777311). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7777311
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile