The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2010
Filed:
Sep. 06, 2005
Takanori Nishida, Ninomiya, JP;
Satoshi Isoda, Ninomiya, JP;
Ryouji Sugiura, Ishioka, JP;
Masayuki Sakurai, Tokyo, JP;
Takanori Nishida, Ninomiya, JP;
Satoshi Isoda, Ninomiya, JP;
Ryouji Sugiura, Ishioka, JP;
Masayuki Sakurai, Tokyo, JP;
Hitachi AIC Inc., Tokyo, JP;
Abstract
For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes. . . within an inside of an insulating substrate, has a base substrateand a reflector substrate, which is laminated and adhered on an upper surface thereof. In the base substrateis formed a though hole, on the reverse surface of which is formed a heat radiating platemade from a thick metal thin film. Also, on an inner periphery and a bottom portion of the through hole are formed a reflection film, and further wiring patterns. . . are formed on the substrate. On the other hand, the reflector substrateis formed with a through hole, having a diameter larger than that of the through hole of the base substrate, and on an inner peripheral surface thereof is formed a reflection film. This reflector substrate is disposed and adhered on an upper surface of the base substrate, at such the position that portions of the wiring patterns are exposed through the through hole thereof, and the plural number of the light emitting diodes are connected to the wiring patterns on the base substrate, to be mounted thereon.