The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2010
Filed:
Jun. 05, 2009
Hongli Suo, Beijing, CN;
Min Liu, Beijing, CN;
Yue Zhao, Beijing, CN;
Meiling Zhou, Beijing, CN;
Lin MA, Beijing, CN;
Tieyong Zuo, Beijing, CN;
Hongli Suo, Beijing, CN;
Min Liu, Beijing, CN;
Yue Zhao, Beijing, CN;
Meiling Zhou, Beijing, CN;
Lin Ma, Beijing, CN;
Tieyong Zuo, Beijing, CN;
Beijing University of Technology, Beijing, CN;
Abstract
A composite article that can be used as a substrate for coated conductors is disclosed. The composite substrate has at least three layers in which one or more inner layers of Ni—W alloys with 9 at. %-13 at. % W and two outer layers of Ni—W alloys with 3 at. %-9 at. % W. The content of W element gradually decreases from the inner layers to the outer layers. The composite substrate can be prepared using a process of designing and sintering composite ingot, rolling composite ingot and then annealing composite substrate. The composite substrate have a dominant cube texture on the outer layer of the whole substrate which have a weaker magnetism and higher strength than that of a single Ni-5 at. % W alloy substrate. the preformed composite ingot is prepared by filling and compacting the Ni—W mixed powders into a mold layer by layer according to the structure of composite substrate; in said mold, said preformed composite ingots are with the total thickness of 5-250 mm, the thickness of two outer layers being 2/9-⅔ of the total thickness.