The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2010

Filed:

Jun. 02, 2008
Applicants:

Tatsuya Watanabe, Anjo, JP;

Masahiko Imoto, Kariya, JP;

Yoshinari Goshima, Toyohashi, JP;

Inventors:

Tatsuya Watanabe, Anjo, JP;

Masahiko Imoto, Kariya, JP;

Yoshinari Goshima, Toyohashi, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.


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