The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2010
Filed:
Dec. 17, 2007
Applicants:
Takashi Shoji, Tokyo, JP;
Takekazu Sakai, Tokyo, JP;
Inventors:
Takashi Shoji, Tokyo, JP;
Takekazu Sakai, Tokyo, JP;
Assignee:
Showda Denko K.K., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B05D 5/12 (2006.01); C23C 30/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10° C. before attaching the solder powder.