The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2010
Filed:
Nov. 01, 2006
Kwang-koo Jee, Seoul, KR;
Jun-hyun Han, Seoul, KR;
Yoon-bae Kim, Seoul, KR;
Abstract
A new shrink fitting method including deformation is disclosed, in which a high bonding force can be obtained without accurate mechanical process such as forming an insertion body having an outer diameter greater than an inner diameter of an object for receiving the insertion body. The shrink fitting method comprises preparing a pipe and a rod material whose inner and outer diameters are different from each other; bonding the pipe and the rod material to each other in a state that the pipe or the rod material is deformed by heating; deforming the pipe to allow the inner diameter of the pipe to be equal to the outer diameter of the rod material; and cooling the bonded pipe and rod material. The shrink fitting method can be widely used for various mechanical parts.