The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Nov. 10, 2006
Applicants:
Michiko Kaya, Ibaraki, JP;
Hiroto Oda, Ibaraki, JP;
Teiichi Inada, Ibaraki, JP;
Inventors:
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/04 (2006.01); C08K 3/36 (2006.01); C08L 71/12 (2006.01); C08L 27/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a resin molding material having a remarkably excellent abrasion resistance while maintaining a favorable mechanical strength. The resin molding material is improved in deterioration of the abrasion resistance caused by an abrasive powder generated from an inorganic substance, particularly from a glass fiber or the like. The resin molding material contains a resin, a carbon substance and an inorganic substance. The carbon substance contains an adhesive carbon substance.