The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Jun. 06, 2008
Albert Birner, Regensburg, DE;
Uwe Hoeckele, Regensburg, DE;
Thomas Kunstmann, Laaber, DE;
Uwe Seidel, Munich, DE;
Albert Birner, Regensburg, DE;
Uwe Hoeckele, Regensburg, DE;
Thomas Kunstmann, Laaber, DE;
Uwe Seidel, Munich, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A structure and method of forming through substrate vias in forming semiconductor components are described. In one embodiment, the invention describes a method of forming the through substrate via by filling an opening with a first fill material and depositing a first insulating layer over the first fill material, the first insulating layer not being deposited on sidewalls of the fill material in the opening, wherein sidewalls of the first insulating layer form a gap over the opening. The method further includes forming a void by sealing the opening using a second insulating layer.