The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Mar. 28, 2007
Applicant:
Koujiro Kameyama, Ota, JP;
Inventor:
Koujiro Kameyama, Ota, JP;
Assignee:
Sanyo Electric Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device with plating film layers for semiconductor device leads is described. A first plating film layer that includes Sn as a main material is formed on a semiconductor device lead in which Cu or Fe—Ni is a main material. The outermost surface of the lead includes a plating film layer in which Sn—Bi is the main material. The plating film layer is formed from a plating liquid in which Bi is introduced from a lead hold means. The Bi content relative to Sn in the first plating film layer is approximately 0 wt. % to 1 wt. %.