The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Nov. 10, 2005
Jong-seok Kim, Hwasung-si, KR;
Yun-kwon Park, Dongducheon-si, KR;
Kuang-woo Nam, Yongin-si, KR;
Seok-chul Yun, Yongin-si, KR;
In-sang Song, Seoul, KR;
Jong-seok Kim, Hwasung-si, KR;
Yun-kwon Park, Dongducheon-si, KR;
Kuang-woo Nam, Yongin-si, KR;
Seok-chul Yun, Yongin-si, KR;
In-sang Song, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A micro electro-mechanical system (MEMS) device package and a method of manufacturing the same are provided. The inventive MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device to provide a space where the MEMS active device is positioned and an electrical path for the MEMS active device, each of the internal electrode pads, and comprises first and second pads arranged opposite to one another with a clearance therebetween; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; connection members each formed on the inner surfaces of the via holes to be in contact with the internal electrode pads at one ends thereof; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are in contact with the other ends of the connection members.