The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Apr. 09, 2003
Katsuhiko Takahashi, Sakura, JP;
Kiwako Ohmori, Sakura, JP;
Masanori Endo, Sakura, JP;
Hikaru Yasuhara, Tokyo, JP;
Takayuki Imai, Sakura, JP;
Akinobu Ono, Tokyo, JP;
Toshiyuki Honda, Kitakatsushika-gun, JP;
Koji Okamoto, Kitakatsushika-gun, JP;
Masafumi Ito, Kitakatsushika-gun, JP;
Katsuhiko Takahashi, Sakura, JP;
Kiwako Ohmori, Sakura, JP;
Masanori Endo, Sakura, JP;
Hikaru Yasuhara, Tokyo, JP;
Takayuki Imai, Sakura, JP;
Akinobu Ono, Tokyo, JP;
Toshiyuki Honda, Kitakatsushika-gun, JP;
Koji Okamoto, Kitakatsushika-gun, JP;
Masafumi Ito, Kitakatsushika-gun, JP;
Fujikura Ltd., Tokyo, JP;
Fujikura Kasei Co., Ltd., Tokyo, JP;
Abstract
A conductive composition capable of producing a conductive coating with excellent flexibility and a high conductivity comparable to that of metallic silver, without using high temperatures as film forming conditions. The conductive composition includes a particulate silver compound and a binder, and optionally a reducing agent and a binder. Silver oxide, silver carbonate and silver acetate and the like are used as the particulate silver compound. Ethylene glycol, diethylene glycol, and ethylene glycol diacetate and the like are used as the reducing agent, and a fine powder of a thermosetting resin such as a polyvalent phenol compound, phenol resin, alkyd resin or polyester resin, or a thermoplastic resin such as a styrene resin or polyethylene terephthalate, with an average particle diameter from 20 nm to 5 μm is used as the binder. Furthermore, the average particle diameter of the particulate silver compound may be from 0.01 to 10 μm.