The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2010
Filed:
Dec. 08, 2003
Applicants:
Thomas R. Bieler, Lansing, MI (US);
Karatholuvu N. Subramanian, Brighton, MI (US);
Sunglak Choi, Lansing, MI (US);
Inventors:
Thomas R. Bieler, Lansing, MI (US);
Karatholuvu N. Subramanian, Brighton, MI (US);
Sunglak Choi, Lansing, MI (US);
Assignee:
Board of Trustees Operating Michigan State University, East Lansing, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D 17/00 (2006.01); B23K 35/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods are disclosed for producing in-situ composite solders having a particulate intermetallic phase homogeneously distributed throughout the solder matrix. An eutectic solder is mixed with the components of the intermetallic phase, melted and rapidly cooled to form the desired solder. In-situ composite solder alloys formed by the disclosed method provide greater solder joint strength and fatigue resistance.