The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Jun. 19, 2007
Minoru Sanada, Osaka, JP;
Yoshirou Nakata, Kyoto, JP;
Minoru Sanada, Osaka, JP;
Yoshirou Nakata, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
Provided is a probe card for semiconductor IC test on one principal surface of which are formed a plurality of probe electrodes, such as bump electrodes (), and which has, in a peripheral portion thereof, a thin film sheet () fixed to a support, such as a ceramics ring (). A local tension-changed portion () is formed in the thin film sheet () fixed to the ceramics ring () so that a tensile strain is generated, and the plurality of bump electrodes () are arranged in prescribed positions that connect electrically to electrodes of each semiconductor IC element of the semiconductor wafer. The tensile strain of the thin film sheet () is changed positively and in a sustained manner, whereby the bump electrodes () are rearranged in desired positions.