The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Feb. 14, 2007
Joon-mo Seo, Suwon-si, KR;
Byoung-un Kang, Yongin-si, KR;
Kyung-tae WI, Ayang-si, KR;
Jae-hoon Kim, Seoul, KR;
Tae-hyun Sung, Seoul, KR;
Soon-young Hyun, Gyeonggi-do, KR;
Byoung-kwang Lee, Gyeonggi-do, KR;
Chan-young Choi, Gyeonggi-do, KR;
Joon-Mo Seo, Suwon-si, KR;
Byoung-Un Kang, Yongin-si, KR;
Kyung-Tae Wi, Ayang-si, KR;
Jae-Hoon Kim, Seoul, KR;
Tae-Hyun Sung, Seoul, KR;
Soon-Young Hyun, Gyeonggi-do, KR;
Byoung-Kwang Lee, Gyeonggi-do, KR;
Chan-Young Choi, Gyeonggi-do, KR;
LG Innotek Co., Ltd., Seoul, KR;
Abstract
A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.