The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7768109 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 03, 2010

Filed:

Aug. 14, 2008
Applicant:

Junichi Nakao, Ibo-gun, JP;

Inventor:

Junichi Nakao, Ibo-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor devicehas a metallic base substratefor heat-dissipating, a wiring board, a MOSFETas a semiconductor element, externally leading terminalsA,B,C, a casingformed of a synthetic resin, a fixing resin, and a gel-like resin layer. On the metallic base substrate, the casingis disposed to surround one ends of the externally leading terminalsA,B,C and the MOSFET. The other ends of the externally leading terminalsA,B,C are externally protruded from the casing, and terminal body portionsA,B,C for coupling them are inserted in through hole portionsA,B,of the casing. The terminal body portionsA,B,C and the through hole portionsA,B,are fixed with the fixing resin, and the gel-like resin layeris formed at the lower part of the casing. A spaceis formed between the gel-like resin layerand the casing


Find Patent Forward Citations

Nakao, Junichi. (2010). Semiconductor device and method of manufacturing the same (U.S. Patent No. 7768109). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7768109

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