The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Mar. 12, 2008
Yong Liu, Scarborough, ME (US);
Jeff Ju, Gorham, ME (US);
Zhongfa Yuan, Jiangsu, CN;
Roger Luo, Shanghai, CN;
Yong Liu, Scarborough, ME (US);
Jeff Ju, Gorham, ME (US);
Zhongfa Yuan, Jiangsu, CN;
Roger Luo, Shanghai, CN;
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.