The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Jun. 23, 2006
Thomas R. Apel, Portland, OR (US);
Thomas R. Apel, Portland, OR (US);
TriQuint Semiconductor, Inc., Hillsboro, OR (US);
Abstract
An interconnect path configured for use in RFICs and configured to reduce inductance at the input of an array of cells, and also at the output of the array of cells. According to one preferred embodiment of the present invention, a multi-layered interconnect formed by at least two metal layers separated by dielectric medium is provided. The metal layers are closely spaced and separated by a desirable dielectric to achieve an interconnect having a characteristic inductance (Zo) that is much lower than typical microstrip transmission lines formed by a metal trace over the semiconductor substrate or a dielectric stack that includes the semiconductor substrate. The low Zo line provides much less inductance per unit length.