The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2010

Filed:

Oct. 13, 2006
Applicants:

Christoph Noelscher, Nuremberg, DE;

Sebastian Mosler, Dresden, DE;

Inventors:

Christoph Noelscher, Nuremberg, DE;

Sebastian Mosler, Dresden, DE;

Assignee:

Qimonda AG, Munich, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention is concerned with a method for manufacturing a local wiring in a semiconductor device, comprising the manufacturing of at least two electrically conducting structures essentially in the same horizontal level in a layered stack on a substrate, the at least two electrically conducting structures being separated by a gap filled with at least one dielectric material, the gap being electrically bridged by conductive material, to form at least one contact element electrically connecting the at least two electrically conducting structures, whereby at least one contact element is produced in a single lithographic step.


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