The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2010

Filed:

Feb. 09, 2005
Applicants:

Yoshiharu Hasegawa, Obu, JP;

Tomohiko Nakamura, Obu, JP;

Masaaki Kawakubo, Obu, JP;

Naoki Yamashita, Nagoya, JP;

Tatsuya Hikida, Nagoya, JP;

Inventors:

Yoshiharu Hasegawa, Obu, JP;

Tomohiko Nakamura, Obu, JP;

Masaaki Kawakubo, Obu, JP;

Naoki Yamashita, Nagoya, JP;

Tatsuya Hikida, Nagoya, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high-strength aluminum alloy extruded product for heat exchangers which excels in extrudability, allows a thin flat multi-cavity tube to be extruded at a high critical extrusion rate, and excels in intergranular corrosion resistance at a high temperature, and a method of manufacturing the same. The aluminum alloy extruded product includes an aluminum alloy including 0.2 to 1.8% of Mn and 0.1 to 1.2% of Si, having a ratio of Mn content to Si content (Mn %/Si %) of 0.7 to 2.5, and having a content of Cu as an impurity of 0.05% or less, with the balance being Al and impurities, the aluminum alloy extruded product having an electric conductivity of 50% IACS or more and an average particle size of intermetallic compounds precipitating in a matrix of 1 μm or less.


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