The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2010

Filed:

Nov. 03, 2006
Applicants:

David Christopher Graham, Lexington, KY (US);

Brian Christopher Hart, Madison, WI (US);

Gary Anthony Holt, Jr., Lexington, KY (US);

John William Krawczyk, Richmond, KY (US);

Sean Terrence Weaver, Union, KY (US);

Mary Claire Smoot, Lexington, KY (US);

Inventors:

David Christopher Graham, Lexington, KY (US);

Brian Christopher Hart, Madison, WI (US);

Gary Anthony Holt, Jr., Lexington, KY (US);

John William Krawczyk, Richmond, KY (US);

Sean Terrence Weaver, Union, KY (US);

Mary Claire Smoot, Lexington, KY (US);

Assignee:

Lexmark International, Inc., Lexington, KY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.


Find Patent Forward Citations

Loading…