The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2010

Filed:

Nov. 08, 2006
Applicants:

Ginawati AU, Aliquippa, PA (US);

Shawn P. Jarvie, Monaca, PA (US);

Justin D. Rubb, Coraopolis, PA (US);

Michael T. Williams, Beaver Falls, PA (US);

Daniel Araos, Viera, FL (US);

Blain Hileman, New Castle, PA (US);

Inventors:

Ginawati Au, Aliquippa, PA (US);

Shawn P. Jarvie, Monaca, PA (US);

Justin D. Rubb, Coraopolis, PA (US);

Michael T. Williams, Beaver Falls, PA (US);

Daniel Araos, Viera, FL (US);

Blain Hileman, New Castle, PA (US);

Assignee:

NOVA Chemicals Inc., Moon Township, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
E04B 2/00 (2006.01); E04C 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A concrete wall forming system including a plurality of mold units for forming a wall of concrete. The mold units include a bond beam form extending into the body lengthwise, defined by a first wall, a second wall, a bond beam form bottom, a first end and a second end where the first wall and second wall extend a depth defined by a portion of the distance from the top surface to the bottom surface and where the bond beam form does not touch the first side or the second side. First and second ledges extend lengthwise along the body from the first and second sides respectively to the first and second walls respectively of the bond beam form. The bond beam form bottom extends from the first wall to the second wall. At least two column forms extend from the bond beam form bottom to a bottom surface.


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