The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Mar. 02, 2006
Akishige Murakami, Ohta-ku, JP;
Ikue Kawashima, Ohta-ku, JP;
Yoshikazu Akiyama, Ohta-ku, JP;
Ricoh Company, Ltd., Tokyo, JP;
Abstract
A method of manufacturing a multilayer wiring structure is disclosed. The method comprises a step of forming a via post on a first metal wiring element, a step of printing an interlayer insulation film on the first metal wiring element, with use of a screen mask having a non-ejection area slightly larger than a head of the via post, such that the interlayer insulation film has an upper surface at the level lower than the head of the via post, while generally aligning the non-ejection area with the head of the via post, a step of curing the interlayer insulation film, and a step of forming a second metal wiring element in contact with the via post on the interlayer insulation film such that the first metal wiring element and the second metal wiring element are connected through the via post.