The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Feb. 01, 2006
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Seiichi Matsumoto, Fukui, JP;
Yoshihiko Takano, Otsu, JP;
Tatsuo Kunishi, Moriyama, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Seiichi Matsumoto, Fukui, JP;
Yoshihiko Takano, Otsu, JP;
Tatsuo Kunishi, Moriyama, JP;
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Abstract
A method for manufacturing a ceramic electronic component having excellent solderability is provided. In this method, the elution of barium from the ceramic electronic component and the adhesion of ceramic electronic components in tin plating are reduced. The method for manufacturing a ceramic electronic component includes the steps of providing an electronic component of barium-containing ceramic and forming an electrode on the outer surface of the electronic component, the electrode being electroplated with tin. In this method, a plating bath used in the tin plating has a tin ion concentration A in the range of 0.03 to 0.51 mol/L, a sulfate ion concentration B in the range of 0.005 to 0.31 mol/L, a molar ratio B/A of less than one, and a pH in the range of 6.1 to 10.5.