The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2010
Filed:
Sep. 10, 2007
Applicants:
Tatsuya Morishita, Osaka, JP;
Osamu Ishikawa, Kyoto, JP;
Inventors:
Tatsuya Morishita, Osaka, JP;
Osamu Ishikawa, Kyoto, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device of the present invention includes: a plurality of semiconductor chips each having a chip size package structure; and a substrate bonded via an adhesive material to an opposite surface in each of the plurality of semiconductor chips that is opposite to a connection surface that is provided with solder balls (external connection terminals). Thereby, the plurality of semiconductor chips are connected to each other.
Quick Actions:
Morishita, Tatsuya. (2010). Semiconductor device, method for manufacturing semiconductor device, and electric equipment system (U.S. Patent No. 7763960). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7763960
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile