The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2010
Filed:
Jun. 14, 2006
Applicants:
Yasuo Yamasaki, Shiojiri, JP;
Hiroki Kato, Suwa, JP;
Inventors:
Yasuo Yamasaki, Shiojiri, JP;
Hiroki Kato, Suwa, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/283 (2006.01); H01L 21/441 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a semiconductor device includes preparing a semiconductor substrate having an electrode pad, a passivation film having an opening overlapping the electrode pad and an oxidized film formed in the opening, forming a resin projection on the passivation film, forming a metal layer on the passivation film and the resin projection, and forming an electrically connecting portion for connecting the electrode pad to the metal layer by substituting an electrical conductor for at least a part of the oxidized film.