The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2010
Filed:
Sep. 29, 2004
Peter Rödhammer, Ehenbichl, AT;
Peter Rödhammer, Ehenbichl, AT;
PLansee SE, Reutte/Tirol, AT;
Abstract
A composite body which can withstand high thermal stresses is formed by high-temperature soldering at least a part of a high-temperature-resistant, metallic or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic component. Prior to soldering, a metallic barrier layer, which is impervious to the solder melt, of one or more elements selected from the group consisting of V, Nb, Ta, Cr, Mo, W, Ti, Zr, Hf and alloys thereof, is deposited on that surface of each nonmetallic component which is to be soldered. Solder material, barrier layer and soldering conditions are adapted to one another in such a manner that during the soldering operation the metallic barrier layer remains at least partially in the solid state, so that after the soldering operation it is still present in a thickness of at least 10 μm at least over the majority of the soldering surface.