The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7762316 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 27, 2010

Filed:

Aug. 06, 2007
Applicants:

Hao-hui Lin, Taitung, TW;

Su-chen HU, Tainan, TW;

Inventors:

Hao-Hui Lin, Taitung, TW;

Su-Chen Hu, Tainan, TW;

Assignee:

Man Zai Industrial Co., Ltd., Tainan, Taw, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat-dissipating device includes a housing, a partitioning member, a finned structure, and a high thermal-conductivity strip. The housing defines an inner space, and has a top surface formed with a retaining groove, and an inlet and an outlet. The partitioning member is disposed in the inner space so as to divide the inner space into first and second compartments that are respectively connected to the inlet and the outlet. The finned structure includes a plurality of partitioning plates disposed in the first compartment so as to divide the first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path, and a plurality of heat-dissipating fins disposed in each of the partitioned sections. The conductive strip is secured in the retaining groove in the top surface of the housing and has a thermal conductivity higher than that of the housing.


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