The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2010
Filed:
May. 26, 2006
Hiroshi Ota, Kanagawa, JP;
Hiroshi Ota, Kanagawa, JP;
Fujifilm Corporation, Tokyo, JP;
Abstract
The method manufactures a wiring substrate. The method comprises: a recess section forming step of forming recess sections corresponding to a prescribed wiring pattern, on a substrate; a filling step of filling a conductive paste containing thinner, into the recess sections; a curing step of causing the conductive paste filled in the recess sections in the filling step to contract, by drying and curing; and a plating step of forming a wiring conductor serving as the wiring pattern, by performing a plating process using the conductive paste in contact with at least a portion of an inner circumferential face of the recess sections, as at least one of a catalyst and a current feed layer.