The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Jan. 08, 2007
Applicant:
Daisuke Ejima, Kanagawa, JP;
Inventor:
Daisuke Ejima, Kanagawa, JP;
Assignee:
NEC Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
Aiming at adjusting the height of bump electrodes connected to lands on a substrate, a semiconductor devicehas a first interconnect substrateand a second interconnect substrate. On one surface of these substrates, first landsand second landsare provided. The plane geometry of the second landsis a polygon characterized by the inscribed circle thereof having an area smaller than the area of the inscribed circle of the first land.
Ejima, Daisuke. (2010). Substrate and semiconductor device (U.S. Patent No. 7759799). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7759799
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile